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Mechatronic Components: Roadmap to Design explains the practical application of mechatronics, including sections on adaptive structures, robotics and other areas where mechanics and electronics converge. Professional engineers in a variety of areas will find this textbook to be extremely helpful with its in-depth use of flow diagrams and schemes that help readers understand the logic behind the design of such systems. Using approximately 130 different components with diagrams and flowcharts that help engineers from different fields understand the general properties and selection criteria of a component, this book presents a comprehensive resource on mechatronic components.

Mechatronics. --- Mechanical engineering --- Microelectronics --- Microelectromechanical systems

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Microelectronics --- Microélectronique --- Microelectronics. --- Périodiques. --- microelectronics --- electronics --- journals --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Microélectronique --- Periodicals. --- Périodiques.

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"Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates"--

Wide gap semiconductors. --- Microelectronic packaging. --- Packaging (Microelectronics) --- Electronic packaging --- Microelectronics --- Wide band gap semiconductors --- Wide bandgap semiconductors --- Semiconductors

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Functional materials have assumed a very prominent position in several high-tech areas. Such materials are not being classified on the basis of their origin, nature of bonding or processing techniques but are classified on the basis of the functions they can perform. This is a significant departure from the earlier schemes in which materials were described as metals, alloys, ceramics, polymers, glass materials etc. Several new processing techniques have also evolved in the recent past. Because of the diversity of materials and their functions it has become extremely difficult to obtain info

Molecular electronics --- Electrooptics --- Optoelectronics --- Materials. --- Engineering --- General and Others --- Molectronics --- Electronics --- Photonics --- Microelectronics --- Nanotechnology

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The book is designed as an introduction for engineers and researchers wishing to obtain a fundamental knowledge and a snapshot in time of the cutting edge in technology research. As a natural consequence, Nano and Giga Challenges is also an essential reference for the ""gurus"" wishing to keep abreast of the latest directions and challenges in microelectronic technology development and future trends. The combination of viewpoints presented within the book can help to foster further research and cross-disciplinary interaction needed to surmount the barriers facing future generations of tech

Molecular electronics. --- Supramolecular chemistry. --- Molectronics --- Chemistry, Physical and theoretical --- Macromolecules --- Microelectronics --- Nanotechnology